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SANKO GOSEI

What is the wall thickness for uniform cooling?

Uniform cooling in the mold during injection molding is effective in reducing residual stress in the resin

However, it is difficult to achieve this depending on the mold layout, product shape, and molding conditions.

For example, if the product shape is tall, such as a cup

Differences may occur between the mold temperature setting and the actual temperature.

This is because the distance from the mold surface to the cooling pipes differs between the Cavi and Core sides of the mold.

It does not mean that the product will be cooled uniformly if the thickness of the product is set uniformly.


Although the temperature controller can change the temperature setting between the Cavi and Core sides, if there is a significant temperature difference

However, if there is a significant temperature difference, the mold dimensions may change between the Cave and Core sides, resulting in galling of the guide pins.

Uniform cooling can be achieved by using 3D cooling piping using a 3D printer or by using an aluminum molding die with high thermal conductivity.

The use of aluminum molds with high thermal conductivity is also an option.

However, if the product shape is not suitable for this purpose, it may be necessary to use a 3D cooling piping using a 3D printer! If this is the case, it is possible to change the thickness of the product (see below).

The thickness of the product can be changed (made thinner) to allow uniform cooling.

Of course, the reduction in wall thickness reduces the rigidity of the product. It is necessary to verify this by CAE, etc. in advance.


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